Chip Manufacturing

Back-End Defect Inspection

ICOS CI-T120/ CI-T130
Share

alt

Product Description

The CI-T120 and -T130 Component Inspectors are configured for high-volume inspection of Gull Wing, BGA, CSP and QFN devices, as well as memory cards. With a default 10-head, pick-and-place handling system and a quadruple pick-and-place head for taping, the CI series offers extraordinary throughput. In addition, changeover time has been reduced to a minimum. The CI series provides high performance at a minimum cost of ownership.


Inspection types:

  • Gull Wing
  • BGA, CSP
  • LGA
  • Leadless devices QFN, BCC
  • Memory cards
  • PGA
  • FCBGA/LGA substrates

Applications:

  • Lead/ball/pad/bump geometry
  • Lead/ball/pad/bump quality
  • Mark/surface
  • Burr/Sliver
  • Orientation / pin 1

Contact Me >


Related Information