Product Description

The SpectraShape^TM 8660 and 8810 dimensional metrology systems are used to fully characterize and monitor the critical dimensions (CD) and three dimensional shapes of complex features on integrated circuits at the 32nm design node and beyond. Using a diverse array of optical technologies and patented algorithms, the SpectraShape systems provide feedback on critical device parameters for a broad range of applications across the IC fab, from the early layers of leading-edge transistors to the last interconnect layers.

• Several optical technologies enable measurement of critical parameters for complex device structures, including:
  • Patented spectroscopic ellipsometer (SE) with broadband light
  • Polarized, enhanced ultra-violet reflectometer (eUVR)
  • Multi-azimuth scatterometry
  • Patented multi-channel scatterometry
• Superior repeatability, reproducibility, matching and reliability enable characterization of small process variations that affect device performance
• Target-based, non-destructive measurements provide 3D profile information without costly wafer cross-sections
• Reduced measurement time compared to previous generation KLA-Tencor optical CD tools produces a high-throughput production solution for CD and shape metrology
• AcuShape2 software package accelerates the process of building robust, usable 3D shape models
• Reliable, extendible architecture protects a fab’s capital investment

AcuShape2 is the advanced modeling software that interprets the signals from the SpectraShape systems. Jointly developed by KLA-Tencor and Tokyo Electron Limited (TEL), AcuShape2 accelerates the process of building robust, usable 3D shape models. It includes a flexible user interface that enables model building by fab engineers with or without assistance from outside experts. Additional AcuShape2 features, such as Model Optimizer which automates the modeling process, help accelerate time to a reliable solution.

Applications

Gate Monitor: Advanced gate processes, such as high k metal gate technologies, or saddle finFET structures in memory, feature more complex device structures and require control of a greater number of measurement parameters. The SpectraShape systems produce a detailed description of the shape of gate structures and identify any deviations beyond allowed tolerances. SpectraShape systems measure parameters (e.g. critical dimension, metal gate recess, high k recess, side wall angle, resist height, hard mask height) critical to understanding and controlling the gate process before and after etch.

BEOL Dual Damascene: For back end of line dual damascene processes, small modulations in parameters, such as the bottom diameter of dual-damascene contacts, can seriously impact device yield or reliability. The SpectraShape systems are used to obtain a comprehensive understanding of trench and contact profiles, providing engineers with a high productivity solution for identifying and monitoring process excursions.

Additional Products

		SpectraCD-XTR: Dedicated CD and profile metrology tool providing cost-effective 3D inline profile measurements for a broad range of structures on 90nm, 65nm, and 45nm devices.
		SpectraCD 200: Production-worthy CD metrology system that delivers high-throughput feature profile information for 90nm, 65nm, and 45nm devices with the added flexibility of providing film thickness data.

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• SpectraCD-XTR Product Overview
• SpectraCD 200 Product Overview

• Use of Multiple Azimuthal Angles to Enable Advanced Scatterometry Applications
• Improved Scatterometry Time to Solution for Leading-Edge Logic Applications