Wafer Edge Inspection and Metrology Systems
The VisEdge CV300R and CV300R-EP wafer edge inspection and metrology systems utilize innovative technology to meet edge-defect inspection and edge metrology requirements for development and volume production of wafers and ICs. The VisEdge CV300R-EP also features edge profile metrology, to ensure in-spec edge geometry and surface integrity of incoming wafers.
Immersion Lithography: Mechanical coupling of the scanner head to the wafer surface through the immersion fluid drives new, stringent specifications for the edges of the lithography film stack. VisEdge defect data helps engineers ramp immersion processes and monitor costly cross-contamination issues in production.
Edge Bead Removal: VisEdge’s edge bead removal (EBR) metrology application characterizes nonuniform edges and identifies overlapping films—key edge bead removal measurements as die real estate concerns shrink the total width of the boundary of the film stack and push it into the side bevel. Improved edge uniformity correlates with lower defect counts generated during immersion lithography.
Film Concentricity Monitoring: Monitor concentricity of films on top, bevel and backside of the wafer to maintain edge exclusion uniformity and lower risk of arcing and other defects related to film edge position.
Deposition, Etch and CMP: VisEdge wafer defect inspection system detects film delamination and flaking created by deposition over residues. These defects generate particles that can migrate to the patterned area of the wafer and affect yield.
Bevel Etch and Clean: Engineers can use VisEdge systems to optimize and monitor the effectiveness of the bevel removal process in both development and production by monitoring defectivity pre-and post-processing.
Wafer Manufacturing OQC and IC Fab IQC: VisEdge monitors for defects such as particles, scratches, mechanical damage, chipping and cracking, and the VisEdge CV300R-EP model also characterizes the edge profile.
The VisEdge technology is also available as a module on the CIRCL macro defect inspection, metrology and review cluster tool.
For more information, please see: CIRCL