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KLA-Tencor Introduces First Complete Lithography Process Control Solution to Optimize Device Yields at The 0.13-Micron Node
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San Jose, CA, April 3, 2000 - KLA-Tencor Corp. (Nasdaq: KLAC) today introduced the semiconductor industry's first comprehensive process module control (PMC) solution for advanced lithography applications. Combining advanced defect detection and metrology systems for both reticles and wafers with sophisticated software, the new Litho PMC solution will allow chipmakers to successfully implement and control the deep sub-wavelength lithography needed to produce semiconductors with 0.13-micron and smaller design rules.

According to Rick Wallace, group vice president, Lithography Group, the 0.13-micron node marks a critical inflection point for the industry since several challenging technology transitions-including sub-wavelength lithography, copper/low-k interconnect and 300 mm wafer processing-are expected to converge at this point. As a result, control of the manufacturing process becomes as critical as the process itself, necessitating new control technologies with unprecedented breadth and depth.

"Controlling the lithography process is the first line of defense against the process excursions and yield-killing defects resulting from these technology transitions," explained Wallace. "To accomplish this successfully, new software capabilities are needed to resolve the challenges unique to deep sub-wavelength lithography. These software solutions need to be just as robust as the essential defect detection and parametric measurement systems."

Wallace reports that the Litho PMC software breakthroughs are the culmination of an aggressive internal development program coupled with several strategic acquisitions including ACME (November 1999), FINLE (February 2000) and Fab Solutions (March 2000). "With these advances, we are providing global chipmakers with a comprehensive solution that addresses all the components needed to successfully implement sub-wavelength lithography-CD control, overlay accuracy, defect reduction and simulation/modeling," continued Wallace. "The result is advanced process control that is both aggressive and highly automated."

Meeting the Technical Challenges of Deep Sub-wavelength Lithography

Despite advances in lithographic steppers and scanners, track systems and photoresists, chipmakers are pushing the at-wavelength lithography limits. As a result, technology leaders must adopt deep sub-wavelength lithography to print design rules that are at least 30 percent smaller than the wavelength of light used in the imaging process. Although successful, this deep sub-wavelength technology requires new control and modeling capabilities since, for the first time, the master image on the reticle is not exactly replicated on the wafer.

"Given these new complexities, the 0.13-micron lithography process window becomes so small that chipmakers need both the right lithography tools and unprecedented lithography process control strategies to maintain high yield," said Scott Ashkenaz, KLA-Tencor's vice president for litho module solutions. "Resolution enhancement techniques prop the window open a little longer, but even these methods are highly susceptible to process variation, which affects CD control, overlay accuracy and defectivity. At the same time, chipmakers face the challenges arising from greater device complexity and increasing device layers, making their lithography process control strategy a critical component of device manufacturing."

To address all of the aforementioned challenges, KLA-Tencor's Litho PMC merges a complete portfolio of advanced systems for both reticles and wafers with innovative software technologies to create a comprehensive, fully integrated deep sub-wavelength lithography control solution that includes:

  • Industry-leading parametric tools to measure and control critical dimensions, overlay, film thickness and reflectivity
  • Complete defect detection systems to find existing and new defect types
  • Advanced software to enable closed-loop automatic feedback and control of the process tools; to correlate parametric results to electrical test results for a true measure of both device yields and device performance; and to find the root causes of defect excursions and facilitate corrective actions
  • Advanced simulation software tools to speed implementation and production ramp of the 0.13-micron design generation-reducing volume of real wafers needed to verify results, thereby greatly reducing development time
  • PMC-Net, which integrates all the process data and components of Litho PMC into a single, automated and customizable data collection, control, analysis and reporting system

    • Together, these powerful tools and systems bring together information from integrated circuit (IC) design through test, including critical elements from the patterning flow. As a result, Litho PMC provides chipmakers with both the yield management strategies and lithography process control needed to successfully navigate the transition to the 0.13-micron node.

    "One-third of fab spending is currently dedicated to the lithography process-making it absolutely vital that fabs adopt a lithography process control strategy that protects and minimizes their investments, and which enables faster time to market," added Ashkenaz. "Our Litho PMC approach is designed to provide those capabilities."

    KLA-Tencor's new Litho PMC is available immediately with prices varying depending on the custom configuration required for each fab. The Litho PMC solution was developed in partnership with leading fabs worldwide.

    PMC and PMC-Net are trademarks of KLA-Tencor.

    Note to editors: Litho PMC Technical Fact Sheet

    About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, Calif., the company has sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the Nasdaq National Market under the symbol KLAC.

    Contact:
    Meggan Powers
    Director Corporate Communications

     

     

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